Kulicke & Soffa iStack Die Bonder
High Performance High Productivity Die Bonder
For Single and Stack Die Bonding
Kulicke & Soffa introduces iStack - the next generation of platform that delivers industry leading throughput and best-in-class yields by leveraging unique advances in functionality.
Unique parallel processing of the pick, transfer and place functions delivers industry leading throughput.
Dynamic Calibration Technology
Dispense and bond heads are continuously calibrated using a unique integrated target built into the heads. An intermediate staging station with an additional camera provides more precise inspection - ensuring that bond accuracy and distribution remain stable over time.