Kulicke & Soffa 7200Plus Automatic Dual-Head Semiconductor Wedge Bonder
Ideal for matrix and standard power leadframe applications, including TO-220, TO-247, D-Pak, Multilead SOP and DSO packages.
The 7200Plus is designed specifically for the power semiconductor industry. Focusing on the needs and trends in this market allowed Orthodyne to engineer a bonder that excels at meeting today's packaging challenges. The 7200Plus has high productivity, process stability, low cost of ownership (COO) and the flexibility to grow with market demands.
The pluses built into the 7200Plus come from Orthodyne's experience and understanding of changing customer needs. Our commitment to outstanding performance, exceptional customer service and ongoing product development has made a better bonder even better.
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