Kulicke & Soffa (South East Asia) Pte Ltd

The State-of the-Art Performance of IConn - the World's leading Wire Bonder - was the starting point for creating the most advanced copper wire bonding capability for today and tomorrow. This is the IConn ProCu. Using development tools such as Computational Fluid

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The ConnX-LED is built upon the new Power Series platform and is optimally designed for bonding LED. New features and enhancements that will help you increase efficiency and net productivity to meet the challenges in bonding LED. As part of the Power Series,

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High Performance High Productivity Die Bonder For Single and Stack Die Bonding Kulicke & Soffa introduces iStack - the next generation of platform that delivers industry leading throughput and best-in-class yields by leveraging unique advances in

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Ideal for matrix and standard power leadframe applications, including TO-220, TO-247, D-Pak, Multilead SOP and DSO packages. The 7200Plus is designed specifically for the power semiconductor industry. Focusing on the needs and trends in this market allowed Orthodyne to

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Hub Blades for Silicon Wafer Dicing K&S offers a full range of dicing blade for silicon wafer. Grit sizes, diamond concentrations, bond hardnesses, and hub configurations are optimized to deliver maximum cut quality, throughput and blade

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Hub Blades for Copper Wafer Dicing Specially-formulated to resist loading when cutting copper-metallized wafers, the new CU Series hub blades reduce top and back side

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Hub Blades for Dicing Low-k Type Wafers NovaTM Hub Blades are an immediate solution to the challenges posed by the dicing of low-k type materials by reducing chipping and

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Tailored Hub Blades for Package Singulation -- for Quality & Long Life Cutting UniPlusTM Hub Blades enable step function improvement on package singulation quality, precision and productivity by providing significantly longer life blades and improved stability, which

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New Hubless Blades Available -- Tailored for Quality and Long Life Cutting UniPlus Hubless Blade is a breakthrough from traditional package singulation solution,enabling step function improvement on cut quality, precision & productivity with significantly longer blade

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ValueCap K&S capillary for any LED bonding process. Key Attributes • Standard capillary design for relatively large BPP and wire diameter • Designed for any LED & Discrete application, using gold wire only • Made out of TA material,

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K&S's AT Premier Stud Bumper offers many technological advantages that make it the ideal choice for a wide range of flip chip product applications. Using industry-standard modeling, this new generation high-speed stud bumper is the clear cost-of-ownership leader in comparison to

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As its name implies, the IConn High Performance Wire Bonder, represents the state-of-the art in IC inter-Conn-ect performance for the advanced packaging requirements for both today and

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